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RM3100 & RM2100 Sensor Suite User Manual Page 14 of 45

Figure 3-9: Recommended Solder Reflow Profile

Table 3-6: Recommended Solder Processing Parameters

Parameter

Symbol

Value

Preheat Temperature, Minimum

Smin

150°C

Preheat Temperature, Maximum

Smax

200°C

Preheat Time (T

Smin

to T

Smax

)

60 – 180 seconds

Solder Melt Temperature

>218°C

Ramp-Up Rate (T

Smax

to T

)

3°C/second maximum

Peak Temperature

<260°C

Time from 25°C to Peak (T

)

6 minutes maximum

Time above T

60 – 120 seconds

Soak Time (within 5°C of T

)

10 – 20 seconds

Rampdown Rate

4°C/second maximum

Footnote:

1. Meets IPC/JEDEC J-STD-020 profile recommendations. Sen-XY-f and Sen-

Z-f classified as moisture sensitivity level 1. MagI2C MLF classified as

moisture sensitivity level 3.

1 2 ... 10 11 12 13 14 15 16 17 18 19 20 ... 43 44

User Manual 1
RM3100 & RM2100 1
Table of Contents 2
List of Figures 3
List of Tables 3
2 Introduction 5
3 Specifications 6
CAUTION: 7
3.3 MagI2C Characteristics 8
3.4.1 Sen-XY-f 9
3.4.2 Sen-Z-f 11
Dimensions in mm 12
3.4.3 MagI2C 13
3.5 Soldering 14
Parameter 15
4.1 Overview 16
C Configuration 17
4.2 Layout 18
4.3 MagI2C Pin-Out 20
Pin Name 21
Description 21
4.3.2 SPI Pins 22
4.3.3 I 23
4.4 SPI Timing Requirements 24
C Requirements 26
4.5.2 I 27
C Register Read 27
5 MagI2C Operation 28
5.2.2 Alarm Mode 32
Absolute Alarm Mode 33
Relative Alarm Mode 34
5.4 Confirm New Data Ready 36
Table 5-10: BIST LR Periods 38
5.6.3 REVID Register (0x36) 39
5.8 Examples using the I 42
C Interface 42

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